Aerospace at RAPID + TCT 2025: Sintavia in the Spotlight
One of the things that we have noticed at RAPID + TCT this year, is undoubtedly the clear focus on applications. From conference sessions to exhibitor booth, we are seeing more concrete examples of how 3D printing can be used, including in the aerospace sector. That’s why, we decided to take a closer look at Sintavia, who were one of our favorite aerospace-focused companies at RAPID + TCT 2025.
In the video below, we stopped by Sintavia’s booth to learn more. Sintavia is a pioneer in metal additive manufacturing for high-performance aerospace components that is based in Florida. The company is well-regarded for its end-to-end control of manufacturing, covering not just the printing process but also post-processing and even metallurgical analysis. We spoke with Jeremy Wong, Lead Digital Manufacturing Engineer, at Sintavia in the interview below to learn more:
In the video, Jeremy highlights the importance of Sintavia’s vertically integrated position in order to create parts that can then be tested and ensure they meet even the highest qualifications for aerospace and defense. He also notes how with traditional manufacturing, you would have 400 different components, all in different locations, that will go through validation separately before being shipped and then put together by the customer. Sintavia is able to produce one solid part comprising all of those components, cutting down on lead time, thanks to additive manufacturing. It is easy to see why additive manufacturing has become so important for the aerospace industry!
What was your favorite aerospace application at RAPID + TCT 2025? Were there others that you saw at the show that you found impressive? Let us know in a comment below or on our LinkedIn, Facebook, and Twitter pages! Don’t forget to sign up for our free weekly newsletter here, the latest 3D printing news straight to your inbox! You can also find all our videos on our YouTube channel. You can also find more aerospace and defense news HERE.
