menu

A New Benchmark for Industrial Stereolithography? Discover 3D Systems’ SLA 825 Dual

Published on November 19, 2025 by Julia S.

For nearly 40 years, Chuck Hull’s curiosity and desire to improve the way products were designed and manufactured gave birth to 3D printing, 3D Systems, and the additive manufacturing industry. Since then, that same spark continues to ignite the 3D Systems team. This full-service solutions partner delivers industry-leading 3D printing technologies, materials and software to high-value markets, from medical and dental to aerospace and defense.

At Formnext this year, 3D Systems is drawing attention with the debut of the SLA 825 Dual, a next-generation stereolithography platform designed to push productivity to new heights. Positioned as the company’s most advanced large-frame SLA system to date, it delivers a 20% larger build volume than previous solutions and introduces new capabilities engineered for high-throughput manufacturing. The launch marks a significant step forward for users seeking both scale and precision in industrial SLA workflows.

To explore what this breakthrough means in practice, we met with Sam Green, Director of Product Management at 3D Systems. In this interview, Sam provides insight into what sets the SLA 825 Dual apart, who it’s built for, and how the system accelerates turnaround times without sacrificing the surface quality and accuracy SLA is renowned for. His perspective sheds light on how 3D Systems is leveraging decades of expertise to define the next era of high-performance stereolithography. If you want to see the SLA 825 Dual yourself, visit 3D Systems at Hall 11.1, Booth D11.

What do you think of SLA 825 Dual? Feel free to share your thoughts in the comments below. You can also follow us on Facebook or LinkedIn! Plus, don’t forget to sign up for our free weekly Newsletter to get the latest 3D printing news straight to your inbox. You can also find all our videos on our YouTube channel. 

Share Your Thoughts

Your email address will not be published. Required fields are marked *

de_DEen_USes_ESfr_FRit_IT